Work

Wire Bonding Failure Investigation in Semiconductor Packaging Process

Year: 2024

Type: conference-paper

Source: IEEE URUCON

DOI: 10.1109/urucon63440.2024.10850051

Authors: Luana S. Rocha, Iara J. Fernandes, Celso Peter, Paulo R. Da S. Pereira

Institution: Universidade do Vale do Rio dos Sinos

Language: English

Topic: Management and Optimization Techniques

Subfield: Strategy and Management

Field: Business, Management and Accounting

Domain: Social Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407026566

FWCI:

Cites: 2

Cited by:

Related to: 10