Predictive Modeling and Optimization of Wafer Warpage in FOPoP Packaging Using Element Birth and Death Technique
Year: 2025
Type: article
Authors: Mei-Ling Wu, Jin-Yu Wu
Institution: National Sun Yat-sen University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407128824