Work

Low-Resistance Interconnects by Bonding Porous Cu Bumps and Ultrathin Cu/Sn Pads

Year: 2025

Type: article

Source: IEEE Transactions on Electron Devices

DOI: 10.1109/ted.2025.3530867

Authors: Zilin Wang, Wenjie Zhao, Zheyao Wang

Institutions: Beijing National Research Center for Information Science and Technology, Tsinghua University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Beijing Municipal Natural Science Foundation

Award: 高可靠Chiplet关键技术研究

OpenAlex ID: W4407129370

FWCI: 0.462

Cites: 40

Cited by: 2

Related to: 10