Year: 2025
Type: article
Abstract: The authors regret an error in Figure 4 and Figure 7 of the published article and have provided corrected versions, see below.Accordingly, the related analysis in the text has been updated as follows.Corrected Figure 4: Figure 4. a) XRD results of copper films sintered at different plasma power for 30 min, b,c) XPS results of copper film sintered at 300 W for 30 min, d) Resistivity of copper films sintered at different temperatures for 60 min and e) at 300 W for different times.
Source: Advanced Electronic Materials
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $3,560
OpenAlex ID: W4407144798
