Work

Study on the Cu Microstructure and Sn Supply Affecting the Interfacial Reaction of Cu/Sn Nanowires for Advanced Electronic Packaging

Year: 2025

Type: article

Source: ACS Applied Electronic Materials

DOI: 10.1021/acsaelm.4c01981

Authors: Ke-Xin Chen, Rui-Chong Li, Li-Yin Gao, Zhi-Chao Meng, Chang Liu, Zhi-Quan Liu

Institutions: University of Science and Technology of China, Chinese Academy of Sciences, Institute of Metal Research, Shenzhen Institutes of Advanced Technology, China Electronics Technology Group Corporation

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Basic and Applied Basic Research Foundation of Guangdong Province

Awards: G5913755193, G6935520047, G7880178250

OpenAlex ID: W4407153302

FWCI: 1.155

Cites: 51

Cited by: 5

Related to: 10