Work

High‐performance Cu–Cu interconnects attained through air sintering of oleylamine‐capped Cu nanoparticles for power electronics packaging

Year: 2025

Type: article

Source: Rare Metals

DOI: 10.1007/s12598-024-03076-y

Authors: Shi‐Yu Xia, Xiang‐Ji Li, Ying‐Jie Guo, Jun‐Jie Yuan, Zhe‐Fei Sun, Hui‐Jun Cao, Shu‐Ye Zhang, Wen‐Zhi Cai, Jin‐Tang Li, Zhi‐Hao Zhang

Institutions: Xiamen University, Sungkyunkwan University, Xiamen City University, Harbin Institute of Technology, State Key Laboratory of Advanced Welding and Joining

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Natural Science Foundation of Fujian Province

Award: G4379480752

OpenAlex ID: W4407156036

FWCI: 4.557

Cites: 53

Cited by: 20

Related to: 10