Work

Low temperature dependence of resistivity in obliquely sputter-deposited gold thin films

Year: 2025

Type: article

Abstract: We report on the electrical resistivity at low temperature of Au thin films 400 nm thick deposited by DC magnetron sputtering using oblique angle deposition (OAD). The deposition angle α is gradually and systematically changed from 0° to 80°. A tilted and voided columnar structure is produced for deposition angles higher than 60°, whereas the lowest angles lead to a dense and compact structure with no clear cross-section morphology. Resistivity vs. temperature measurements reveal a typical metallic-like behavior in the range 7–300 K whatever the deposition angle. The latter gives rise to a significant increase of residual resistivity and temperature coefficient of resistance, and again for the most grazing angles, i.e. , α > 60°. The Bloch-Grüneisen model is assumed for understanding the evolution of electron-phonon interactions as a function of the deposition angle. This enhanced resistivity is connected to the structural defects and the porous architecture especially emphasized for glancing angles, and the strengthening of the electron-phonon coupling for high deposition angles. • Au thin films are sputtered by oblique angle deposition with an angle α = 0° to 80°. • A porous and tilted columnar architecture is produced for glancing deposition angles. • Resistivity vs. temperature is used to assess electron-phonon interactions. • The electron-phonon coupling strength enhances for high deposition angles.

Source: Surface and Coatings Technology

DOI: 10.1016/j.surfcoat.2025.131884