One-shot nanoscale surface height variation measurement of a bare silicon wafer using a single reflectance direction field
Year: 2025
Type: article
Abstract: It has been demonstrated that nanoscale height variations on a bare silicon wafer can be reconstructed from a single image obtained in one shot using a color mapping imaging system of a reflectance direction field. This imaging system can acquire the direction of light rays reflected from the wafer's surface as color information by utilizing a filter with a multicolor stripe pattern. A prototype of the imaging system is capable of capturing an image of a 12 × 8 mm area of the silicon wafer with a resolution of 2.18 × 2.18 µm. The height error distribution in the reconstruction from the ideal surface varies between -18% and 6%.
Source: Optics Continuum
Authors: Hiroshi Ohno, Akifumi Ohno, Hiroya Kano, Takahiro Kamikawa, Kenta Takanashi, Hideaki Okano
Institution: Toshiba (Japan)
Language: English
Subfield: Computer Vision and Pattern Recognition
Field: Computer Science
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $1,372
OpenAlex ID: W4407182327