Work

Effect of Warpage Pattern of Printed Circuit Board on Solder Paste Volume in the Stencil Printing Process

Year: 2025

Type: article

Source: Journal of Manufacturing Science and Engineering

DOI: 10.1115/1.4067847

Authors: Majid Mohammadhosseinzadeh, Hyeongtae Kim, Hossein Ghorbani-Menghari, Jungbin Park, Namhyun Kang, Myung Keun Jung, Seung Ryul Na, Ji Hoon Kim

Institution: Pusan National University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Ministry of Science, ICT and Future Planning, Korea Institute for Advancement of Technology, Korea Basic Science Institute

Awards: G2585568387, G342071005, G7892284203

OpenAlex ID: W4407194976

FWCI: 0.451

Cites: 14

Cited by: 2

Related to: 10