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Fast and Accurate EUVL Thick-Mask Model Based on Multi-Channel Attention Network

Year: 2025

Type: article

Source: IEEE Transactions on Semiconductor Manufacturing

DOI: 10.1109/tsm.2025.3539300

Authors: Chengzhen Yu, Sheng Liu, Wensheng Chen, Xu Ma

Institution: Beijing Institute of Technology

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G3964752667

OpenAlex ID: W4407212805

FWCI:

Cites: 27

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Related to: 10