Work

Invited Paper: Low-Temperature SiO2/SiO2 Wafer Direct Bonding by N2 Plasma Activation

Year: 2024

Type: conference-paper

Source: IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)

DOI: 10.1109/icta64028.2024.10860674

Authors: Xiaohui Yuan, Linjie Liu, Xiangyu Zhou, Shijiao Xu, Chenxi Wang

Institution: Harbin Institute of Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

OpenAlex ID: W4407213807

FWCI: 0.806

Cites: 6

Cited by: 1

Related to: 10