Work

Prediction of Substrate Warpage by the Trace Mapping and Trace Reinforcement Method During Solder Reflow

Year: 2024

Type: conference-paper

Source: IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)

DOI: 10.1109/icta64028.2024.10860494

Authors: Yu Yao, Haozhou Wang, Jun Wang

Institution: Fudan University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

OpenAlex ID: W4407214177

FWCI:

Cites: 4

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Related to: 10