Work

Design and Packaging of a W Band CMOS Power Amplifier

Year: 2024

Type: conference-paper

Source: IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)

DOI: 10.1109/icta64028.2024.10860387

Authors: Dongxin Ni, Liang Zhou, Jixuan Wang, Zhaoxiang Ren, Shang Zhang, Wangwen Xu, Jian Pang

Institution: Shanghai Jiao Tong University

Language: English

Topic: Advanced Power Amplifier Design

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407214196

FWCI:

Cites: 4

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Related to: 10