Work

Modeling the Resistance Variation of Heterogeneous Integrated Interconnect Structures under Electrical Stress

Year: 2024

Type: conference-paper

Source: IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)

DOI: 10.1109/icta64028.2024.10860525

Authors: Kun He, Huanpeng Wang, Musheng Liang, Yuehang Xu

Institution: University of Electronic Science and Technology of China

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407214442

FWCI: 0.806

Cites: 3

Cited by: 1

Related to: 10