Work

Design and Manufacturing Features of a Three-Dimensional Microsystem with Side Commutations

Year: 2024

Type: article

Source: Russian Microelectronics

DOI: 10.1134/s106373972470080x

Authors: I. A. Belyakov, D. V. Vertyanov, M. D. Kochergin, S. P. Timoshenkov

Institution: National Research University of Electronic Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407335622

FWCI: 0.103

Cites: 8

Cited by: 1

Related to: 10