Development of high‐performance silk‐based composite films with enhanced thermal conductivity and EMI shielding effectiveness
Year: 2025
Type: article
Source: Polymer Composites
DOI: 10.1002/pc.29612
Authors: Jaekyung Lee, Jaeyeon Kim, Jaeyeon Kim, Oju Kwon, Subin Lee, Pei‐Chen Su, Jooheon Kim, Jooheon Kim
Institutions: Chung-Ang University, Nanyang Technological University
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
Award: G550402108
OpenAlex ID: W4407374013
