Work

Steady state creep of the silver-tin TLP interconnections of power modules

Year: 2025

Type: article

Source: Multidiscipline Modeling in Materials and Structures

DOI: 10.1108/mmms-09-2024-0283

Authors: Mohammad A. Gharaibeh, Markus Feisst, Jürgen Wilde

Institutions: Hashemite University, University of Freiburg

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407393574

FWCI: 0.231

Cites: 38

Cited by: 2

Related to: 10