Work

Defect Reduction and Line Width Roughness Improvement by Using a Post Precoat Treatment in Waferless Chamber Conditioning

Year: 2025

Type: article

Source: IEEE Transactions on Semiconductor Manufacturing

DOI: 10.1109/tsm.2025.3535145

Authors: Jeff J. Ye, Raviteja Pagadala, Fei Lu

Institutions: Micron (United States), Intel (United States)

Language: English

Topic: Plasma Diagnostics and Applications

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407433238

FWCI: 0.693

Cites: 6

Cited by: 3

Related to: 10