Work

Maximum Chip Temperature Direct Monitoring for Press-Pack IGBT Integrating Temperature Sensors

Year: 2025

Type: article

Source: IEEE Transactions on Power Electronics

DOI: 10.1109/tpel.2025.3541744

Authors: Ziyang Zhang, Lin Liang, Li Wang, Zhiyuan Zhang, Kaijun Wen, Liuyu Tu

Institutions: State Key Laboratory of Advanced Electromagnetic Engineering and Technology, Huazhong University of Science and Technology, China Three Gorges Corporation (China)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

Funder: National Key Research and Development Program of China

OpenAlex ID: W4407433405

FWCI: 1.842

Cites: 28

Cited by: 8

Related to: 10