Work

Achievement and Assessment of 6-in Wafer Bonding Based on a Novel Nanosilver Sintering Method

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3541627

Authors: Xiaoguang Wei, Xiaoliang Zhao, Xinling Tang, Liang Wang, Hao Zhang, Yanzhong Tian, Ronggang Han

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407450153

FWCI: 1.13

Cites: 33

Cited by: 5

Related to: 10