Work

Combining Molecular Interaction and Physical Anchoring Effect to Achieve Ultra-High Adhesion Electroless Copper Plating on Glass Substrates

Year: 2025

Type: article

Abstract: High-adhesion metallization on glass substrates has consistently been one of the technical challenges in using glass as the substrate in high-performance integrated circuit (IC) carriers. To improve the adhesion of electroless copper layers on glass substrates, this study developed a nano-palladium catalyst capped with 3-aminopropyltriethoxysilane (APTES) as a self-adsorbing activator for electroless copper deposition, paired with a thin porous titanium dioxide (TiO2) adhesion-promoting layer. This approach successfully increases the adhesion strength of the electroless copper layer to 1392 gf cm−1, significantly exceeding the practical target value of 500 gf cm−1. Experimental and analytical results confirm that the high adhesion is due to the formation of Si-O-Ti bonds between APTES-Pd and TiO2, allowing the electroless copper to firmly deposit on the TiO2. Additionally, the porous TiO2 layer provided extra physical anchoring, further enhancing the adhesion.

Source: Journal of The Electrochemical Society

DOI: 10.1149/1945-7111/adb5c9

Authors: Pei-Qing Yang, Yi-Ting Wu, Tzu-Chien Wei

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: hybrid

Estimated APC paid: $1,950

Funder: National Science and Technology Council

Award: G8201363364