Study on the Interfacial Structure and Thermal Conduction of Spark Plasma Sintering Diffusion‐Bonded Diamond/Cu Composites with Ni Interlayer
Year: 2025
Type: article
Source: Advanced Engineering Materials
Authors: Lei Wang, Daochun Hu, Minghe Chen, Shaohui Feng, Ning Wang, Ying Zhou
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
Award: G4484003604
OpenAlex ID: W4407550530