Development of Panel Level Packaging for Multi-Chip Modules with High-Precision Redistribution Layer
Year: 2024
Type: conference-paper
Authors: Zeyu Ma, Di He, Gaolin Li, Junbo Jiang, Xuan Gao, Qiang Tang, Yuhang Peng, Tao Sun, Hu
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407575038