Work

High-Density Flip Chip Solder Bump Bridging Detection Using YOLOv7

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875277

Authors: Lau Wei Theng, Lee Jun-On, Lam Pooi Kit

Institution: Intel (Malaysia)

Language: English

Topic: Industrial Vision Systems and Defect Detection

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407575044

FWCI:

Cites: 8

Cited by:

Related to: 10