Work

FCLGA Study with Polymide (PI) Removal from Chip Surface

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875158

Authors: David Liu, Lok Sook Kuen, Eu Poh Leng, Gao Zhenpeng, Lu Jian, Chin Teck Siong

Institutions: NXP (Germany), Tongfu Microelectronics (China)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407575050

FWCI:

Cites: 8

Cited by:

Related to: 10