Work

Improvement of Laser Groove Bottom Width in Complementary Metal-Oxide-Semiconductor (CMOS) Low-k Wafer Technology

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875219

Author: Mohd Fauzi Bin Mohd Noh

Language: English

Topic: Laser Material Processing Techniques

Subfield: Computational Mechanics

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407575055

FWCI:

Cites: 2

Cited by:

Related to: 10