Work

C5 Reflow and Flux Clean Characterization for Automotive FCBGA

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875236

Authors: Muhammad Syakir Turiman, Cai Hui Tan, Dominic Koey Poh Meng

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407575058

FWCI:

Cites: 8

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Related to: 10