Work

Challenges and Resolutions of 28nm Copper Wire Bond Process for Automotive Application

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875262

Authors: Pey Fang Hiew, Tsung-Nan Lo, Poh Leng Eu, Shih-Shuang Huang, Sam Lai, Howard Liu, Krassavan Tantirittisak, JW Chen

Institutions: Siliconware Precision Industries (Taiwan), NXP (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407575072

FWCI: 0.806

Cites: 11

Cited by: 1

Related to: 10