Pressure and Pressure-less Cu Sintering Paste Developed for Next Generation Interconnection Material
Year: 2024
Type: conference-paper
Authors: Min Yao, Li Ma, Hongyun Li, Yan Wu, Xuelian Han, Xiaoqin Lu, Zhongrui Zhao, Meng Li, Fen Chen, Yan Liu
Institution: Indium Corporation (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407575074