Work

Low- and Mid-Temperature Pb-Free Solder Preform Technology in Substrate Attach Application for Improved Thermomechanical Performance

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875264

Authors: Sunny Neoh, Joseph Hertline, Ryan Mayberry, Alexander Russell

Institution: Indium Corporation (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407575079

FWCI:

Cites: 3

Cited by:

Related to: 10