Exploration on Miniaturization of Immersion Cooling Technology for Client Desktop and Edge Devices
Year: 2024
Type: conference-paper
Authors: Khai Ern See, Baomin Liu, Eng Kwong Lee, Chin Kung Goh, Cora Nien, Chun Keang Ooi, Jia Yan Go
Institutions: Intel (Malaysia), Intel (United States), Intel (Taiwan)
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407575089
