Work

Industrialization of a New Adhesion Promoter Process for Leadframe

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875282

Authors: Paolo Crema, Din Ghee Neoh, Riccardo Villa, Boon Seong Lee, Christian Ohde

Institutions: STMicroelectronics (Italy), Atotech (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407575091

FWCI:

Cites: 1

Cited by:

Related to: 10