Work

Manufacturability of A Novel Vertical Interconnect Design for High-Speed Signaling

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875062

Authors: Jackson Kong, Bok Eng Cheah, Kok Hou The, Hong Cheah Ho

Institutions: Intel (United States), Intel (Malaysia)

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407575095

FWCI:

Cites: 3

Cited by:

Related to: 10