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Energy Saving in Semiconductor Packaging Plating Processes Through Chemical Deflashing Process Optimization

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875094

Author: Arieff Yusoff

Institutions: Selangor Business School, Emery Oleochemicals (Malaysia)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Responsible consumption and production

Open Access status: closed

OpenAlex ID: W4407575100

FWCI:

Cites: 3

Cited by:

Related to: 10