Influence of moisture variation on SAC405 solder ball oxidation characteristic in WLCSP
Year: 2024
Type: conference-paper
Authors: Chofu Liu, Eu Poh Leng, Lau Teck Beng, Viola Lee, Steve Hsieh, S Lee Ming Shong, Simon Jude Madelo Burgos
Institutions: China University of Technology, Malacca General Hospital
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407575104
