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Strip Lasermarking Offset Marking Defect Improvement For Small Outline Packages

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875160

Authors: Devar Raja Ramalingam, Chee Aung Koo, Mohd Aizat Bin Abas

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407575113

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Cites: 2

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Related to: 10