Effective Lead Lock Tape Solution for Mitigating Leadframe's Lead Bend in Semiconductor Packaging
Year: 2024
Type: conference-paper
Authors: Mahenthren Palaniappan, Dhanaraj Perumal, Nur Amirah Zainal Abdin, Wai Leong Khiew, Lim Zikang, Nur Aqilah Husin
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407575114