Work

Development of Robust Cu Wire Looping for Small Sensor QFN Package with Higher Dual Die Stack

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875168

Authors: Antonio A. M. Macatangay, Pey Fang Hiew, Eu Poh Leng, Chayathorn Saklang, Lo Hsiang, Tai Po Huang, Chi Hao Lin

Institutions: NXP (Germany), Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: NXP Semiconductors

OpenAlex ID: W4407575117

FWCI:

Cites: 8

Cited by:

Related to: 10