Work

High Density Interconnect (HDI) Socket Dynamic Warpage Prediction by Mori-Tanaka Model

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875244

Authors: Chun Keang Ooi, Muhammad Naqib Nashrudin, Philip Chang, Wen Li Xu, Lili Ding, Pierre-Louis Toussaint, Yan YZ Lin, Devon Heil, Wei Keat Loh, Haley Fu

Institutions: Intel (Malaysia), Foxconn (Taiwan), Celanese (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407575118

FWCI:

Cites: 10

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Related to: 10