Work

Novel Bond-Wire Optimization Method for PISI and Yield Improvement

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875096

Authors: Rishi Bhooshan, Ajay Kumar Sharma, Jasmine Lim, Yin Kheng Au, Swapnil Tiwari

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407575119

FWCI:

Cites: 3

Cited by:

Related to: 10