Work

Investigation of Package Delamination Behavior in Large Quad Flat No-Lead Package

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875261

Authors: Tsung Nan Lo, Chang Hao Liu, Pey Fang Hiew, Wen Hung Huang, Poh Leng Eu, Shih Shuang Huang

Institution: Siliconware Precision Industries (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407575144

FWCI:

Cites: 12

Cited by:

Related to: 10