Laser Ablation Dicing Revolutionizes Ultra-thin Wafer Saws Beyond the Capability of Blade Dicing
Year: 2024
Type: conference-paper
Author: Siang Miang Yeo
Institutions: Selangor Business School, Emery Oleochemicals (Malaysia)
Language: English
Subfield: Computational Mechanics
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407575158