Warpage Simulation Including the Effect of Molding Compound Cure Shrinkage
Year: 2024
Type: conference-paper
Authors: Bin Gu, Jing-En Luan, Phone Maw Hla
Institution: STMicroelectronics (Singapore)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407575184