Work

Leadframe Strip Stiffness Simulation for Identification of Issues During Package Singulation Process

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875260

Authors: M. A. A. Afripin, B. T. Y. Fang, J. J. M. Zaal

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407575288

FWCI:

Cites: 12

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Related to: 10