The Effect of Ion Implantation on Carbon Diffusion Through Si/SiOx Layer
Year: 2024
Type: conference-paper
Authors: Pui Key Poon, Tatt Wai Wan, Chan Lik Tan, Kuan Yew Cheong
Institution: Universiti Sains Malaysia
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: Infineon Technologies
OpenAlex ID: W4407575291
