Work

New Enhanced Loop Formation for Compute DRAM Package: An Innovative Solution to Enhance Robustness of Wire Loop and Enable Design Rule Limitation

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875149

Authors: Ling Luo Ing, Aldin-John Andam Tuazon, Kwok Ting Sheng

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407575317

FWCI:

Cites: 6

Cited by:

Related to: 10