Work

Multi Row QFN Wire Gap Clearance Improvement Using Improved Mold Compound

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875128

Authors: Chantana Tangcharoensuk, Pey Fang Hiew, Eu Poh Leng, Kanna Krishnasamy, Natawat Kasikornrungroj, Panumard Thammavet

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: NXP Semiconductors

OpenAlex ID: W4407575319

FWCI: 0.806

Cites: 8

Cited by: 1

Related to: 10