Micro bumping via Paste Dispensing Technology for Advanced Packaging
Year: 2024
Type: conference-paper
Authors: Senthil Kumar Balasubramanian, Yam Lip Huei, Edrina Risson Olakkankal, Zhang Rui Fen, Tai Kian Chong, Muizzuddin Azfar
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407575320