Work

Base loop characterization to alleviate short tail issue in stack die package

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875292

Authors: Nisha Veloo, Aldin-John Andam Tuazon, Amnani Rosland

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407575328

FWCI:

Cites: 5

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Related to: 10