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Effective Approach to Achieve Zero Interfacial Delamination on High-Power Automotive Devices After Reliability Test

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875204

Authors: Chin Joo Tan, Azamer Kastor, Mohd Hasrul Zulkifli, Ahmad Shahril Khamarazaman, Kwang Jun Lee, Mee Sing Tiong, Boo Wei Tan

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407575336

FWCI:

Cites: 11

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Related to: 10